At the "13th Laser Anwender Forum (LAF) 2024" in Bremen, more than 100 interested participants will meet to discuss current topics, trends and visions for the future in the fields of laser beam welding, additive manufacturing, microstructuring and process monitoring.

Connect with us at the metal industry's leading two-day event

The XVIII Jornadas Laser Workshop is part of the IX International Laser Week to be held on october 2024.

PCB depaneling using green laser technology, combined with scanning optics, is a cutting-edge method for separating individual circuit boards from larger panels with high precision. Green lasers (usually 532 nm) offer a shorter wavelength, allowing for fine, clean cuts with minimal thermal stress, reducing the risk of damaging sensitive electronic components. The addition of scanning optics enables fast, accurate movement of the laser beam across complex board layouts, ensuring high throughput and precise control.